NSN 5961-01-014-3135 Semiconductor Device Set manufactured by Avago Technologies Us Inc, Hewlett Packard Co, Herley Chicago is available within ASAP Part Service’s ready-to-ship inventory. Owned and operated by ASAP Semiconductor, ASAP Part Services has over 6 billion parts within its inventory including 019-004933, 48P228651-01. ASAP is committed to streamlining the parts procurement process for our customers. We make it easy for our customers to search through billions of parts to find the exact part they are looking for.
A dedicated ASAP account manager is ready to help solve any procurement issues or needs that a customer may have. As a company we are quick and responsive meaning we can deliver a part within an AOG timeframe. Quality control is at the center of all that we do. Each and every NSN 5961-01-014-3135 part is subject to numerous quality checks that are designed to screen out any part imperfections or validity issues. Subject a request for quote for NSN 5961-01-014-3135 part today and allow us to simplify your procurement process.
Alternative NSN: 5961-01-014-3135 |
Item Name:Semiconductor Device Set |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5961 Semiconductor Devices and Associated Hardware |
NCB Code: USA (01) |
Manufacturers: Avago Technologies Us Inc , Hewlett Packard Co , Herley Chicago |
Part No Part No
|
Manufacturer NSN Parts
|
Item Name Item Name
|
QTY QTY
|
RFQ RFQ
|
---|---|---|---|---|
019-004933 | Avago Technologies Us Inc | semiconductor device set | Avl | RFQ |
019-004933 | Hewlett Packard Co | semiconductor device set | Avl | RFQ |
48P228651-01 | Hewlett Packard Co | semiconductor device set | Avl | RFQ |
48P228651-01 | Herley Chicago | semiconductor device set | Avl | RFQ |
48P228651-01 | Avago Technologies Us Inc | semiconductor device set | Avl | RFQ |
HP5082-2804 | Hewlett Packard Co | semiconductor device set | Avl | RFQ |
HP5082-2804 | Avago Technologies Us Inc | semiconductor device set | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | GLASS |
ABHP | OVERALL LENGTH | 0.170 INCHES MAXIMUM |
ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM |
ADAV | OVERALL DIAMETER | 0.076 INCHES MAXIMUM |
ASDD | COMPONENT FUNCTION RELATIONSHIP | MATCHED |
ASKA | COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
AXGY | MOUNTING METHOD | TERMINAL |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 0.41 MAXIMUM FORWARD VOLTAGE, DC AND 70.00 MINIMUM BREAKDOWN VOLTAGE, DC |
CTQX | CURRENT RATING PER CHARACTERISTIC | 15.00 MILLIAMPERES SOURCE CUTOFF CURRENT PRESET |
CTRD | POWER RATING PER CHARACTERISTIC | 250.0 MILLIWATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR ABSOLUTE |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 DEG CELSIUS AMBIENT AIR |
TEST | TEST DATA DOCUMENT | 26916-019-004933 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING D |
TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
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