NSN 5962-01-319-8466 Microcircuit Memory manufactured by Dla Land And Maritime, Boeing Company is available within ASAP Part Service’s ready-to-ship inventory. Owned and operated by ASAP Semiconductor, ASAP Part Services has over 6 billion parts within its inventory including ROM PROM FAMILY 029, M38510 21002BJA, 520-11077-508. ASAP is committed to streamlining the parts procurement process for our customers. We make it easy for our customers to search through billions of parts to find the exact part they are looking for.
A dedicated ASAP account manager is ready to help solve any procurement issues or needs that a customer may have. As a company we are quick and responsive meaning we can deliver a part within an AOG timeframe. Quality control is at the center of all that we do. Each and every NSN 5962-01-319-8466 part is subject to numerous quality checks that are designed to screen out any part imperfections or validity issues. Subject a request for quote for NSN 5962-01-319-8466 part today and allow us to simplify your procurement process.
Alternative NSN: 5962-01-319-8466 |
Item Name:Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NCB Code: USA (01) |
Manufacturers: Dla Land And Maritime , Boeing Company |
Part No Part No
|
Manufacturer NSN Parts
|
Item Name Item Name
|
QTY QTY
|
RFQ RFQ
|
---|---|---|---|---|
ROM PROM FAMILY 029 | Dla Land And Maritime | microcircuit memory | Avl | RFQ |
ROM PROM FAMILY 029 | Boeing Company | microcircuit memory | Avl | RFQ |
M38510 21002BJA | Boeing Company | microcircuit memory | Avl | RFQ |
M38510 21002BJA | Dla Land And Maritime | microcircuit memory | Avl | RFQ |
520-11077-508 | Dla Land And Maritime | microcircuit memory | Avl | RFQ |
520-11077-508 | Boeing Company | microcircuit memory | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
ABHP | OVERALL LENGTH | 1.290 INCHES MAXIMUM |
ABKW | OVERALL HEIGHT | 0.425 INCHES MAXIMUM |
ABMK | OVERALL WIDTH | 0.620 INCHES MAXIMUM |
ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.02 WATTS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | 6111-01-212-1076 |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 2 PRINTED CIRCUIT |
ADAT | BODY WIDTH | 0.610 INCHES MAXIMUM |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-3 MIL-M-38510 |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | BIPOLAR AND BURN IN AND ELECTROSTATIC SENSITIVE AND MONOLITHIC AND SCHOTTKY AND PROGRAMMED |
CQZP | INPUT CIRCUIT PATTERN | 13 INPUT |
CZER | MEMORY DEVICE TYPE | ROM |
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