NSN 5962-01-381-8974 Microcircuit Memory manufactured by Ge Aviations Systems Llc, Dla Land And Maritime is available within ASAP Part Service’s ready-to-ship inventory. Owned and operated by ASAP Semiconductor, ASAP Part Services has over 6 billion parts within its inventory including 170217-06, 548989-02-01, 5962-8606302YA. ASAP is committed to streamlining the parts procurement process for our customers. We make it easy for our customers to search through billions of parts to find the exact part they are looking for.
A dedicated ASAP account manager is ready to help solve any procurement issues or needs that a customer may have. As a company we are quick and responsive meaning we can deliver a part within an AOG timeframe. Quality control is at the center of all that we do. Each and every NSN 5962-01-381-8974 part is subject to numerous quality checks that are designed to screen out any part imperfections or validity issues. Subject a request for quote for NSN 5962-01-381-8974 part today and allow us to simplify your procurement process.
Alternative NSN: 5962-01-381-8974 |
Item Name:Microcircuit Memory |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NCB Code: USA (01) |
Manufacturers: Ge Aviations Systems Llc , Dla Land And Maritime |
Part No Part No
|
Manufacturer NSN Parts
|
Item Name Item Name
|
QTY QTY
|
RFQ RFQ
|
---|---|---|---|---|
170217-06 | Ge Aviations Systems Llc | microcircuit memory | Avl | RFQ |
170217-06 | Dla Land And Maritime | microcircuit memory | Avl | RFQ |
548989-02-01 | Dla Land And Maritime | microcircuit memory | Avl | RFQ |
548989-02-01 | Ge Aviations Systems Llc | microcircuit memory | Avl | RFQ |
5962-8606302YA | Ge Aviations Systems Llc | microcircuit memory | Avl | RFQ |
5962-8606302YA | Dla Land And Maritime | microcircuit memory | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
TTQY | Terminal Type And Quantity | 32 LEADLESS |
MRC | Decoded Requirement | Clear Text Reply |
CTQX | Current Rating Per Characteristic | 50.00 MILLIAMPERES MAXIMUM SUPPLY |
CZER | Memory Device Type | EPROM |
AFJQ | Storage Temp Range | -65.0 TO 150.0 DEG CELSIUS |
CQZP | Input Circuit Pattern | 25 INPUT |
CQSJ | Inclosure Material | CERAMIC |
TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
ADAT | Body Width | 0.458 INCHES MAXIMUM |
CBBL | Features Provided | HERMETICALLY SEALED AND BURN IN AND PROGRAMMED AND ELECTROSTATIC SENSITIVE AND ULTRAVIOLET ERASABLE |
ADAQ | Body Length | 0.560 INCHES MAXIMUM |
AEHX | Maximum Power Dissipation Rating | 500.0 MILLIWATTS |
ADAU | Body Height | 0.120 INCHES MAXIMUM |
CTFT | Case Outline Source And Designator | C-12 MIL-M-38510 |
CQSZ | Inclosure Configuration | LEADLESS FLAT PACK |
AFGA | Operating Temp Range | -55.0 TO 125.0 DEG CELSIUS |
CZEP | Capitance Rating Per Characteristic | 12.00 INPUT PICOFARADS MINIMUM AND 14.00 OUTPUT PICOFARADS MAXIMUM |
CWSG | Terminal Surface Treatment | SOLDER |
CZEN | Voltage Rating And Type Per Characteristic | 14.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | Time Rating Per Chacteristic | 250.00 NANOSECONDS MAXIMUM ACCESS |
CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
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