NSN 5962-01-576-4945 Microcircuit Linear manufactured by Thales Air Systems Sa, Thales Avionics Inc, Hittite Microwave Corporation is available within ASAP Part Service’s ready-to-ship inventory. Owned and operated by ASAP Semiconductor, ASAP Part Services has over 6 billion parts within its inventory including 91793094, HMC284MS8G. ASAP is committed to streamlining the parts procurement process for our customers. We make it easy for our customers to search through billions of parts to find the exact part they are looking for.
A dedicated ASAP account manager is ready to help solve any procurement issues or needs that a customer may have. As a company we are quick and responsive meaning we can deliver a part within an AOG timeframe. Quality control is at the center of all that we do. Each and every NSN 5962-01-576-4945 part is subject to numerous quality checks that are designed to screen out any part imperfections or validity issues. Subject a request for quote for NSN 5962-01-576-4945 part today and allow us to simplify your procurement process.
Alternative NSN: 5962-01-576-4945 |
Item Name:Microcircuit Linear |
FSG: 59 Electrical and Electronic Equipment Components |
Federal Supply Class (FSC): 5962 Microcircuits Electronic |
NCB Code: USA (01) |
Manufacturers: Thales Air Systems Sa , Thales Avionics Inc , Hittite Microwave Corporation |
Part No Part No
|
Manufacturer NSN Parts
|
Item Name Item Name
|
QTY QTY
|
RFQ RFQ
|
---|---|---|---|---|
91793094 | Thales Air Systems Sa | microcircuit linear | Avl | RFQ |
91793094 | Thales Avionics Inc | microcircuit linear | Avl | RFQ |
91793094 | Hittite Microwave Corporation | microcircuit linear | Avl | RFQ |
HMC284MS8G | Thales Avionics Inc | microcircuit linear | Avl | RFQ |
HMC284MS8G | Thales Air Systems Sa | microcircuit linear | Avl | RFQ |
HMC284MS8G | Hittite Microwave Corporation | microcircuit linear | Avl | RFQ |
MRC | Criteria | Characteristic |
---|---|---|
CXCY | Part Name Assigned By Controlling Agency | LOW STRESS INJECTION MOLDED PLASTIC |
MRC | Decoded Requirement | Clear Text Reply |
FEAT | Special Features | LEADFRAME MATERIAL, COPPER ALLOY; DIMENSIONS ARE IN INCHES (MILLIMETERS); DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15MM PER SIDE; DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25MM PER SIDE; ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND; THIS ITEM IS A LOW-COST SPDT SWITCH IN 8-LEAD GROUNDED BASE MSOP PACKAGES; THE DESIGM HAS BEEN OPTIMIZED TO PROVIDE HIGH ISOLATION WITH MINIMAL INSERTION LOSS FOR MEDIUM AND LOW POWER APPLICATIONS; ON-CHIP CIRCUITRY ALLOWS POSITIVE VOLTAGE CONTROL OPERATION AT VERY LOW DC CURRENTS WITH CONTROL INPUTS COMPATIBLE WITH CMOS AND MOST TTL LOGIC FAMILIES |
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