We’re pleased to announce that EP1210DM883B (Microcircuit Digital, NSN: 5962-01-318-4485) is now in stock and ready for immediate quoting. This component, manufactured by Crane Electronics Inc (CAGE Code: 50821), is classified under NIIN 01-318-4485 and NCB Code 01 (USA), with additional categorization under FSG 59 Electrical and Electronic Equipment Components/FSC 5962 Microcircuits Electronic and INC 31779. Our team can provide same-day shipping for urgent requirements.
To receive your competitive quote within 15 minutes, simply complete our RFQ form part EP1210DM883B, ensuring all required fields are filled. Our streamlined process guarantees fast, no-obligation pricing so you can secure your supply of EP1210DM883B without delay. Contact us today to meet your procurement needs efficiently
ASAP Part Services, a trusted subsidiary of ASAP Semiconductor, is a premier distributor of Crane Electronics Inc components—specializing in obsolete and hard-to-find parts. As an AS9120B, ISO 9001:2015, and FAA AC 0056B certified supplier, we adhere to the highest industry standards under the Aviation Suppliers Association (ASA). Our global network spans 5,000+ top manufacturers, ensuring access to over 2 billion unique parts for critical needs.
With strategically located shipping centers in California, we offer rapid same-day or next-day delivery on in-stock items like EP1210DM883B. Whether you're sourcing rare components or need expedited logistics, we provide reliable solutions to keep your operations moving forward.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-318-4485 Item PartTypeName: MICROCIRCUIT,DIGITAL | 5962 | 013184485 | N | B | ||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
B | A | 0 | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
EP1210DM883B | 5 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 2.096 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.620 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 380.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND ERASABLE AND BIDIRECTIONAL AND W/CLOCK |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 37 INPUT |
CSSL | DESIGN FUNCTION AND QUANTITY | 1 ARRAY,LOGIC |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.2 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 90.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 90.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 40 PRINTED CIRCUIT |
End Use : 21320 | Semiconductors |
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Schedule B : 8542900000 (NAICS 334413) | Electronic integrated circuits and microassembly parts |
SITC : 77689 | Parts of electronic integrated circuits and microassembles |
ADPE | Represents items with no adp components |
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CRITL | The item does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. |
ESD | B - Represents items with esd sensitivity. |
HMIC | N - Indicates there is no data in the hmirs and the nsn is in a fsc not generally suspected of containing hazardous materials. |
PMIC | A - Item does not contain precious metal. |
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