We’re pleased to announce that 49A0295-000 (Microcircuit Memory, NSN: 5962-01-094-9069) is now in stock and ready for immediate quoting. This component, manufactured by Intel Corporation (CAGE Code: 34649), is classified under NIIN 01-094-9069 and NCB Code 01 (USA), with additional categorization under FSG 59 Electrical and Electronic Equipment Components/FSC 5962 Microcircuits Electronic and INC . Our team can provide same-day shipping for urgent requirements.
To receive your competitive quote within 15 minutes, simply complete our RFQ form part 49A0295-000, ensuring all required fields are filled. Our streamlined process guarantees fast, no-obligation pricing so you can secure your supply of 49A0295-000 without delay. Contact us today to meet your procurement needs efficiently
ASAP Part Services, a trusted subsidiary of ASAP Semiconductor, is a premier distributor of Intel Corporation components—specializing in obsolete and hard-to-find parts. As an AS9120B, ISO 9001:2015, and FAA AC 0056B certified supplier, we adhere to the highest industry standards under the Aviation Suppliers Association (ASA). Our global network spans 5,000+ top manufacturers, ensuring access to over 2 billion unique parts for critical needs.
With strategically located shipping centers in California, we offer rapid same-day or next-day delivery on in-stock items like 49A0295-000. Whether you're sourcing rare components or need expedited logistics, we provide reliable solutions to keep your operations moving forward.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-094-9069 Item Description: MICROCIRCUIT,MEMORY | 5962 | 010949069 | N | |||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 49A0295-000 | 3 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CZEQ | Time Rating Per Chacteristic | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| AFJQ | Storage Temp Range | -55.0/+150.0 DEG CELSIUS |
| CZER | Memory Device Type | ROM |
| CQZP | Input Circuit Pattern | 10 INPUT |
| ADAT | Body Width | 0.275 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| CQSJ | Inclosure Material | CERAMIC |
| TEST | Test Data Document | 21101-49A0295 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
| MRC | Decoded Requirement | Clear Text Reply |
| TTQY | Terminal Type And Quantity | 16 PRINTED CIRCUIT |
| CWSG | Terminal Surface Treatment | SOLDER |
| CBBL | Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND DYNAMIC AND W/STROBE AND W/ENABLE |
| ADAQ | Body Length | 0.780 INCHES MINIMUM AND 0.820 INCHES MAXIMUM |
| AEHX | Maximum Power Dissipation Rating | 1.25 WATTS |
| ADAU | Body Height | 0.185 INCHES MAXIMUM |
| AFGA | Operating Temp Range | +0.0/+70.0 DEG CELSIUS |
| CQSZ | Inclosure Configuration | DUAL-IN-LINE |
| CQWX | Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN | Voltage Rating And Type Per Characteristic | -0.5 VOLTS MINIMUM POWER SOURCE AND 25.0 VOLTS MAXIMUM POWER SOURCE |
| CZZZ | Memory Capacity | UNKNOWN |
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